New Original Electronic Components IC Chips Xilinx Xc7K160t-2ffg676c Kintex-7 Fpga 162240 Cells 250 Hr User I/O 8gtx 28nm Speed Grade 2 Commerical Grade BGA676

Basic Info

Model NO.	XC7K160T-2FFG676C
Transport Package	Tray
Specification	25350LABs 162240Cells 1.4MB RAM
Trademark	Virtex-7
Origin	Original
HS Code	8542390000

Product Description

Physical
Case/Package	FCBGA
Contact Plating	Copper, Silver, Tin
Number of Pins	676
Technical
Max Operating Temperature	85 °C
Max Supply Voltage	1.03 V
Min Operating Temperature	0 °C
Min Supply Voltage	970 mV
Number of ADC Channels	1
Number of I/Os	400
Number of Logic Blocks (LABs)	12675
Number of Logic Elements/Cells	162240
Number of Registers	202800
Number of Transceivers	8
RAM Size	1.4 MB
Speed Grade	-2
Compliance
Radiation Hardening	No
RoHS	Compliant

General Description
Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series FPGAs include:• Spartan®-7 Family: Optimized for low cost, lowest power, and high I/O performance. Available in low-cost, very small form-factor packaging for smallest PCB footprint.• Artix®-7 Family: Optimized for low power applications requiring serial transceivers and high DSP and logic throughput. Provides the lowest total bill of materials cost for high-throughput, cost-sensitive applications.• Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.• Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

Summary of 7 Series FPGA Features
• Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.• High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.• High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to max. rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.• Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.• Quickly deploy embedded processing with MicroBlaze™ processor.• Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.• Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.• Low-cost, wire-bond, bare-die flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.• Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.

Xilinx is now part of AMD. AMD (NASDAQ: AMD) announced on Feb. 14, 2022 the completion of its acquisition of Xilinx in an all-stock transaction. The acquisition, originally announced on October 27, 2020, creates the industry's high-performance and adaptive computing leader with significantly expanded scale and the strongest portfolio of leadership computing, graphics and adaptive SoC products. AMD now has the industry's broadest product portfolio and a highly complementary set of technologies, reaching customers in a diverse set of markets. Together, AMD and Xilinx leverage the right engine for the right workload to address the compute needs for our customers. Learn more about the new AMD here.
Notice:
1. As a Diamond Member and an Audited Supplier of Made-in-China since 2014, Telefly guarantees that all the semiconductor chips and other electronic components we provide are 100% new and original, all the chips and components are from formal channels and can be traced back to original manufacturers. 2. All products we provide will be double checked and proper inspection process will be strictly followed before delivery.3. We promise to provide at least 1 year after-sell service for all products we sell.4. Due to the reality of sometime volatile changes of the chips and components' stock and prices, please contact with us for their availability and quoting prices before payment.5. We use DHL, UPS, FedEx, TNT, HONGKONG Post, EUB, EMS or other global express delivery services you designate.
Company Profile
Company Profile
TELEFLY Telecommunications Equipment is a leading Chinese Telecommunications Equipment manufacturer and a semiconductor chip and other electronic component distributor founded in 2004, certified by SGS, CFL Certification Center. We provide high quality and price competitive semiconductor chips and other electronic components, Ethernet switch ,SFP transceiver,media converter ,patch cable, Fiber Optic Splitter and so on. Up till now, our products and solutions have been deployed in over 60 countries and regions, TELEFLY is looking forward to strengthening friendly cooperative relationships with all clients, creating benefits together and sharing the joy of success!

Our Advantages

Why you choose TELEFLY be one of your partner?
1.Customer get satisfied quality and service with competitive price and punctual delivery.
2.OEM service with 13-year experiences, free samples are available.
3.Prompt answer for any question and inquiry in the shortest time.
4.Factory directly,reduce your cost and save time.

1.Customer get satisfied quality and service with competitive price and punctual delivery.2.OEM service with 13-year experiences, free samples are available.3.Prompt answer for any question and inquiry in the shortest time.4.Factory directly,reduce your cost and save time.
FAQ

Q1 . What your MOQ?

A1 .If not specified, 1 pcs is ok,whatever how many you need,and we will also give you the best service.

Q2.What certification did you get?

A2 : Our product strictly operate the ISO9001:2008 quality control system and we passed the CE,FCC,ROHS and SGS test,you can trust us.

Q3 :What about your package and delivery,will it broke during shipping?

A3:You don't need to worry about the package,we will use shockproof case for delivering.

Q4.What your common delivery way?

A4:By air, by sea or express(UPS,DHL,Fedex,TNT,EMS...)We will make a perfect delivery plan for you.

Q5.Tell me some detail about warrant time.

A5:We give you the promise if any question during 1 year and not cause by human factors,we will fix it.